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News Article

Boosting mobile phone camera performance

STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.

The VS6650 is a high-performance, low-power 1Mpixel (1152x864) camera module, capable of streaming full-resolution images at 30 frames per second (fps). A high-speed serial video interface operating at up to 650Mbit/s has been engineered to minimise electromagnetic interference, enabling camera placement even close to radio areas. A low pin count and embedded power and clock management comply with mobile-phone design constraints.

The STV0976 processor with built-in real-time JPEG compression can handle full-resolution images up to 15fps at 1Mpixel. Image reconstruction techniques provide power-efficient defect correction, lens-distortion compensation and sharpness enhancement, specifically tailored for small-sized lens modules.

"Bringing Megapixel capability to the mainstream of mobile phones is a major challenge for our customers today as the lack of standards and narrow choice of architecture keep bill-of-material costs high," says Marc Vasseur, general manager of ST's Imaging division.

STÕs camera modules are manufactured in a fully automated test and focus process, using the company's Small Optical module (SmOP II) technology. The VS6650 comes in the SMIA95 standard package (9.5x9.5x7.6mm), equipped with an electromagnetic compatibility (EMC) shield. ST expects major component suppliers for the mobile phone market, such as SMK and Tyco Electronics, to offer a range of SMIA-compliant attachment solutions, and in particular sockets for the SMIA95 module.

The STV0976 is housed in a small TFBGA-56 6x6-mm package and requires a single 1.8V supply and features 60mW standby power consumption.

Volume production is scheduled for March 2005 for the 1Mpixel kit (STV0976 and VS6650 chipset) and January 2005 for a SuperVGA (480kpixel, 800x600) version (STV0976 and VS6590). ST's upcoming SMIA sensors and processors will cover devices up to 3.2Mpixels.

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