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News Article

Embedded chips offer alternative to paper trail

Japanese paper maker Oji Paper Ð in association with FEC Group and Toppan Forms Ð has developed technology to embed semiconductor chips in paper.
Japanese paper maker Oji Paper Ð in association with FEC Group and Toppan Forms Ð has developed technology to embed semiconductor chips in paper.

The company has perfected a production process that installs a 0.5x0.5mm chip, complete with a built-in antenna for wireless transmission, within a sheet of paper.

Available in both sheets and rolls, the paper is slightly thicker than regular paper but in every other respect is indistinguishable.

The technology could have a wide range of uses, from providing electronically tagged bills and cheques that can be automatically tracked to creating currency that is very difficult to counterfeit.

Oji demonstrated the chip-embedded paper at the Smart Labels Asia 2004 exhibition held in Tokyo over November 9-11.

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