BE Semiconductor Industries (Besi) and Datacon Technology will merge to form a leading global advanced IC packaging system supplier. Besi will take over all of Datacon's shares, in return for which shareholders will receive 90% cash as well as shares. The purchase price in euros was just below the three-figure millions - including net financial liabilities. The negotiations with Besi are in the final stages. The merger is likely to take place in January next year, once all antitrust and other formal matters have been clarified.
BE Semiconductor Industries (Besi) and Datacon Technology will merge to form a leading global advanced IC packaging system supplier. Besi will take over all of Datacon's shares, in return for which shareholders will receive 90% cash as well as shares. The purchase price in euros was just below the three-figure millions - including net financial liabilities. The negotiations with Besi are in the final stages. The merger is likely to take place in January next year, once all antitrust and other formal matters have been clarified.
Besi and Datacon have a common customer portfolio and complement each other in their packaging solutions, with virtually no overlaps. Datacon's management says that it had been looking for some time for a way to safeguard the company in the long term because, although successful, it operates in a highly volatile market.
Helmut Rutterschmidt, president of Datacon Technology, comments: "Although Datacon is highly profitable and the leader in market segments such as flip chip technology, in global terms it is not one of the major key players in the international semiconductor equipment market."
Besi insists that its aim is not the complete disappearance of Datacon into the overall group, but rather to give it a large degree of autonomy within the group. The "Datacon" name and brand will be retained, as will the global corporate structure.
