News Article
Axcelis clinches AMD contract
Axcelis Technologies has won a contract to supply low-energy single-wafer implant technology for chip making giant AMD's new 300mm fab in Dresden, Germany.
The Massachusetts-based company claims that its product is the only single-wafer implant solution available that meets AMD's need for well and channel and high-tilt HALO implant applications in the 90nm to 45nm technology nodes.
Wafer implanting is one of the most technically difficult and vital parts of the semiconductor production process and is becoming ever more challenging as chip makers seek to scale transistors down to 90nm and below.
At such resolutions, slight inaccuracies in implant angles and the presence of tiny amounts of contaminants can play havoc with a chip's performance.
Axcelis chief operating officer Mike Luttati said: "As devices scale beyond the 90nm technology node, energy, contamination and angle control play a much larger role, and our platform excels in these areas."
The Massachusetts-based company claims that its product is the only single-wafer implant solution available that meets AMD's need for well and channel and high-tilt HALO implant applications in the 90nm to 45nm technology nodes.
Wafer implanting is one of the most technically difficult and vital parts of the semiconductor production process and is becoming ever more challenging as chip makers seek to scale transistors down to 90nm and below.
At such resolutions, slight inaccuracies in implant angles and the presence of tiny amounts of contaminants can play havoc with a chip's performance.
Axcelis chief operating officer Mike Luttati said: "As devices scale beyond the 90nm technology node, energy, contamination and angle control play a much larger role, and our platform excels in these areas."
