News Article
Infineon and Parlex team up on substrates
Chipmaking giant Infineon and interconnect manufacturer Parlex Corporation have announced plans to set up a joint venture to produce advanced substrates for secure mobile electronic identification products.
The new company will be headquartered in Hong Kong and have manufacturing facilities in China.
Under the terms of the agreement, Parlex will own a 51% equity share, with Infineon holding the remaining share. Infineon will pay Parlex $3 million and Parlex will contribute equipment and technology.
Parlex Shanghai Circuit Company will also provide certain additional services which will be paid for by the joint venture.
In addition to supplying substrates for Infineon's flip chip on substrate programme, the joint venture will offer products to customers worldwide. It is anticipated that the new company will be operational in April 2005.
Parlex president and chief executive officer Peter Murphy: "Combining resources with the recognised market and technology leader for electronic identification products allows us to rapidly introduce a variety of new technologies developed specifically to serve this expanding customer segment."
The new company will be headquartered in Hong Kong and have manufacturing facilities in China.
Under the terms of the agreement, Parlex will own a 51% equity share, with Infineon holding the remaining share. Infineon will pay Parlex $3 million and Parlex will contribute equipment and technology.
Parlex Shanghai Circuit Company will also provide certain additional services which will be paid for by the joint venture.
In addition to supplying substrates for Infineon's flip chip on substrate programme, the joint venture will offer products to customers worldwide. It is anticipated that the new company will be operational in April 2005.
Parlex president and chief executive officer Peter Murphy: "Combining resources with the recognised market and technology leader for electronic identification products allows us to rapidly introduce a variety of new technologies developed specifically to serve this expanding customer segment."
