News Article
European firms invest in New York mega project
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.
The new 38,000m2 plant will be based at IBMs existing facility in the Fiskhill area of the city. It is due to come on stream in 2005 and will be used to produce state-of-the-art chips such as the new Cell processor IBM is developing in partnership with Toshiba and Sony.
The investment is set to create 1,000 new jobs, around 250 of which will be related research initiatives. The New York state has promised to contribute $150 million to the project.
Under the deal, IBM, which is based in New York, and its industry partners have also agreed to invest millions of dollars on funding advanced manufacturing research projects at universities in the city.
Another European firm, Netherlands-based lithography giant ASML, is also involved on the project. The company plans to build in New York its first major silicon wafer research centre outside Europe.
The US$400 million new facility – to be funded jointly by IBM and ASML – will undertake research into 300mm-wafer technology.
The new 38,000m2 plant will be based at IBMs existing facility in the Fiskhill area of the city. It is due to come on stream in 2005 and will be used to produce state-of-the-art chips such as the new Cell processor IBM is developing in partnership with Toshiba and Sony.
The investment is set to create 1,000 new jobs, around 250 of which will be related research initiatives. The New York state has promised to contribute $150 million to the project.
Under the deal, IBM, which is based in New York, and its industry partners have also agreed to invest millions of dollars on funding advanced manufacturing research projects at universities in the city.
Another European firm, Netherlands-based lithography giant ASML, is also involved on the project. The company plans to build in New York its first major silicon wafer research centre outside Europe.
The US$400 million new facility – to be funded jointly by IBM and ASML – will undertake research into 300mm-wafer technology.
