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News Article

Electrically Insulating Epoxy Resists Up To 500°F

Master Bond has formulated EP121AO, a new low viscosity thermal conductive, electrically insolative two component epoxy compound for potting, casting, encapsulation and sealing for service temperatures up to 500°F. The Master Bond EP121AO epoxy resin compound is comprised of a specially developed heat resistant liquid epoxy resin and a unique curing agent which exhibits unexcelled thermal stability.

The mixed Master Bond EP121AO system exhibits a long pot (working) life at ambient temperatures and is readily cured at temperatures ranging from 275°F to 400°F. After cure it has a thermal conductivity of 10 Btu•in/ft2•hr•°F, as well as excellent mechanical strength properties, superior electrical insulation characteristics and outstanding thermal stability. Master Bond EP121AO features remarkable long term heat resistant properties at temperatures in the 400-450°F range and can be readily subjected to repeated temperature excursions as high as 500°F.

Its shrinkage is negligible and it has superb dimensional stability. EP121AO has excellent flowability and low exotherm during cure and can therefore be safely employed for casting, potting, and encapsulation, in either thick or thin sectioned shapes.

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