News Article
Leica introduces next generation mask metrology tool
Leica has released its new mask metrology tool at the European Mask and Lithography Conference (EMLC) in Dresden. The Leica LMS IPRO3 is a new high end device that is designed to support mask metrology for the 65 nm technology node and beyond. Compared to the previous tool generation it provides an improved measurement precision with a short term repeatability of better than 1.5 nm (3s).
The design of the LMS IPRO3 combines maximum throughput with minimum programming time and operator interference. All measurement jobs can easily be prepared and learned on- or offline. Another characteristic is a data evaluation software package DEVA that remains an integral part of Leica Microsystems’ LMS IPRO metrology solution. It automates the statistical analysis of the gathered data and allows the user to define data evaluation macros. Due to its networking capability, operators and engineers can remotely operate the system and evaluate the results.
