News Article
Infineon samples dual-die memory modules
German chip maker Infineon Technologies has sampled the industry’s first dual-die based 4GB DDR2 registered DIMMs (dual inline memory modules) for server applications.
German chip maker Infineon Technologies has sampled the industry’s first dual-die based 4GB DDR2 registered DIMMs (dual inline memory modules) for server applications.
The new module is based on eighteen 2Gbit DDR2 components, realised by stacking two 1Gbit DDR2 SDRAMs. This approach - called dual die technology – makes it possible to double memory density while increasing component height by only 0.1mm.
Infineon’s 4GB DDR2 registered DIMMs have a 4.1mm module thickness and a standard-size height of 30mm, making them around 40% thinner than comparable solutions. They outperform the Joint Electronic Device Engineering Council’s requirements for stacked solutions.
Dual die technology is achieved by stacking two identical dies in one ball grid array package. But this technique poses manufacturing challenges.
To meet production requirements, Infineon has developed additional process steps necessary to handle the complex interaction of thermal and electrical factors, density, size and power consumption.
The new module is based on eighteen 2Gbit DDR2 components, realised by stacking two 1Gbit DDR2 SDRAMs. This approach - called dual die technology – makes it possible to double memory density while increasing component height by only 0.1mm.
Infineon’s 4GB DDR2 registered DIMMs have a 4.1mm module thickness and a standard-size height of 30mm, making them around 40% thinner than comparable solutions. They outperform the Joint Electronic Device Engineering Council’s requirements for stacked solutions.
Dual die technology is achieved by stacking two identical dies in one ball grid array package. But this technique poses manufacturing challenges.
To meet production requirements, Infineon has developed additional process steps necessary to handle the complex interaction of thermal and electrical factors, density, size and power consumption.
