News Article
EV Group wins innovation award for SOI bonder
Wafer processing equipment maker EV Group has won the Austrian Innovation Award 2004 for a silicon-on-insulator (SOI) production bonder it has developed.
Wafer processing equipment maker EV Group has won the Austrian Innovation Award 2004 for a silicon-on-insulator (SOI) production bonder it has developed.
The Austrian firm beat off competition from more than 400 companies to win the Austrian Ministry of Economic Affairs-backed award.
EV Group chief executive officer Peter Podesser said that award was vindication of the companys strategy of "constantly" developing new technologies.
The company claims that it is the only worldwide supplier of automated SOI wafer bonders and has systems installed in the fabs of all manufacturers of SOI wafers.
The Austrian firm beat off competition from more than 400 companies to win the Austrian Ministry of Economic Affairs-backed award.
EV Group chief executive officer Peter Podesser said that award was vindication of the companys strategy of "constantly" developing new technologies.
The company claims that it is the only worldwide supplier of automated SOI wafer bonders and has systems installed in the fabs of all manufacturers of SOI wafers.
