Info
Info
News Article

Plastic Fantastic

Dutch research team's breakthrough in non-volatile plastic memory could pave the way for innovative new radio frequency tag applications.

Dutch research teams breakthrough in non-volatile plastic memory could pave the way for innovative new radio frequency tag applications.


Researchers at the University of Groningen in Holland and scientists at Philips Research have made a major breakthrough in plastic electronics. They have for the first time developed a non-volatile plastic memory technology that meets the performance needs of commercial plastic electronics applications such as radio frequency (RF) identification tags.

The researchers claim that the new technology could do for plastic electronics what Flash memory has done for silicon chips.

The advent of Flash - a non-volatile memory that does not lose its data when the power is turned off - revolutionised consumer electronics. It is used to store the numbers in mobile phones, the pictures taken with digital cameras and the music tracks in MP3 players.

Non-volatile memory could also play a major role in plastic electronics, paving the way for innovative applications such as food packaging that can alert consumers when its contents are close to their use-by date and power-saving electronic price tags that remember the sale price even when they are turned off.

The non-volatile plastic memory developed by the University of Groningen and Philips Research teams is based on organic field-effect transistors in which the gate dielectric (the insulating layer between the transistors gate and its channel) is composed of a polymer ferroelectric material. Ferroelectrics are materials that can be switched between two different charge states using a high voltage pulse. Because each state is stable, persisting long after the voltage pulse is removed, the transistor can be used as a memory device.

The charge difference between these two states changes the threshold voltage (turn-on voltage) of the transistor, which means that the contents of the memory can be read electrically by applying a voltage to the transistors drain electrode and detecting whether or not current flows in its channel. Although ferroelectric field effect transistors have been researched before, the University of Groningen/Philips Research team is the first to produce a device with short programming time, long data retention time and high programme-cycle endurance using a low-temperature low-cost technology. In addition, all the devices operating voltages, such as the voltage needed to programme and read individual memory cells, are within the limits of tagging applications, and can be reduced even further by downscaling the transistor dimensions.

“Knowing the physics and making it work are two different things,” said Ronald Naber of the University of Groningen. “One of the major breakthroughs we have made is finding ways of laying down the different layers of material in such a way that the ferroelectric effect is not masked by other effects such as charge trapping at the interface between the ferroelectric and semiconducting layers or by material impurities.” An important feature of the fabrication process is the ability to deposit the ferroelectric layer as well as the other layers out of a solution. This makes the process suitable for large-scale industrialisation using low-cost techniques such as spin-coating or printing.

The low process temperature also allows the manufacture of memory on flexible substrates such as cheap plastics.












AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
ASML Reports €14.0 Billion Net Sales
Will Future Soldiers Be Made Of Semiconductor?
Panasonic Microelectronics Web Seminar
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
ITRI And DuPont Inaugurate Semiconductor Materials Lab
AP&S Expands Management At Beginning Of 2021
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Cadence Announces $5M Endowment To Advance Research
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
DISCO's Completion Of New Building At Nagano Works Chino Plant
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
New Plant To Manufacture Graphene Electronics
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
EV Group Establishes State-of-the-art Customer Training Facility
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
TEL Introduces Episode UL As The Next Generation Etch Platform
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Onto Innovation Announces New Inspection Platform
SUSS MicroTec Opens New Production Facility In Taiwan
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Changes In The Management Board Of 3D-Micromac AG

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event