Samsung unveils eight-die multi-chip package
The Samsung MCP combines two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM in a single 11mm x 14mm x 1.4mm package.
The package is of interest in that it is no thicker than the company's four-die MCP solution. Typically, the thickness of a package increases in proportion to the number of chips it contains.
But Samsung prevented this happening by using an innovative wafer supporting system technology to both reduce wafer thickness and minimise the space between the stacked dies.
"The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications," said a Samsung spokesman.
"It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster internet access."
