Packaging
These 3D packages also incorporate the latest lead-free and halogen-free materials, die thinning, die attach, and fine pitch wire bonding technologies. Both packages are ultra thin (less than or equal to 1.0mm), with exposed die paddles that can be soldered to the motherboard for enhanced thermal performance and grounding.
Stacked die QFN packages are currently available in either punch or saw singulated versions, in both single and dual row variations. Portable applications include radio frequency (RF), power management and wireless LAN devices.
The stacked die TQFP-ep format combines superior thermal performance with higher lead count devices, as used in HDTV/CATV, high speed communication modules and portable consumer electronics such as camcorders and digital cameras.
