Sales & orders
SEZ Group announced its first 300mm production win in Korea. A world-leading memory manufacturer has selected SEZ's multi-chamber spin-processor technology for back-end-of-line (BEOL) polymer removal on dynamic random-access memory (DRAM) devices. The SEZ tool has been shipped and is currently installed and running.
This customer is also the first Korean chipmaker to deploy dilute sulphuric peroxide, plus (DSP+) for 300mm memory manufacturing. SEZ is pioneering the use of its 300mm systems with DSP+, an emerging polymer-removal chemical compound with the potential to replace conventional strippers in high-volume manufacturing due to its relatively low cost of ownership (CoO) and enhanced electrical characteristics.
Osram Opto Semiconductors has placed an additional follow-on order for a SUSS MicroTec LithoFab200 production lithography cluster. The cluster is to be used for the manufacturing of nitride and arsenide/phosphide based LEDs. The LithoFab200 integrates all photolithography process steps - coat, bake, expose and develop - in one modular cluster system. Osram Opto Semiconductors will be using "Mask Pellicle Technology" for defect control, part of SUSS' SupraYield process enhancement platform.
Entegris announced $5.6mn in repeat business to the number one memory chipmakers in Germany and South Korea. The German and Korean companies are purchasing two of Entegris' wafer handling products - the A300 and F300 front opening unified pods (FOUPs).
