News Article
Packaging
Advanced Interconnect Technologies (AIT) had a new family of etched leadless packages (ELP) based upon newly confirmed patented technology.
Advanced Interconnect Technologies (AIT) had a new family of etched leadless packages (ELP) based upon newly confirmed patented technology.
The ELP framework implements AIT's selective etching process, allowing tighter integration of multiple I/Os into a reduced area. Three variations are available: Etched Leadless Package (ELP), Etched Leadless Package-Flip Chip (ELPF) and Etched Leadless Grid Array (ELGA). The ELPF incorporates AIT's licensed copper pillar bump technology to connect the die to the leadframe.
AIT's ELP packages will be in full production capacity from AIT's factory in Batam, Indonesia, beginning Q1 2005.
