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Robotic Vision Systems (RVSI) says that a leading logic manufacturer has selected the WS-3000 wafer inspection system for installation at a new 300mm wafer fab facility in Europe.
Robotic Vision Systems (RVSI) says that a leading logic manufacturer has selected the WS-3000 wafer inspection system for installation at a new 300mm wafer fab facility in Europe. The order is the fourth WS-series system ordered by the customer and the first destined for the European facility.

The system is capable of both surface defect review and bump metrology. The system's capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.

Shanghai Hua Hong NEC Electronics (HHNEC) has adopted Synopsys' Proteus optical proximity correction (OPC) software. HHNEC is a 200mm foundry joint venture between NEC, Jazz Semiconductor and Shanghai Hua Hong Group. HHNEC selected Proteus to increase accuracy, decrease mask synthesis turn-around-time and obtain higher yields through the use of Proteus' scalable architecture. STATS ChipPAC has selected Teradyne's FLEX test system for applications including communications, broadband and other consumer ICs.

FLEX machinery with microwave capability is already installed at STATS ChipPAC Test Services, the company's elite test facilities in San Diego and Milpitas, California, as well as at its high volume production facilities in Malaysia and Singapore. FLEX is designed to test analogue and complex mixed-signal systems-on-chip.

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