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Investment & expansion

FlipChip International has opened a Reliability & Design centre for wafer level packaging (WLP) and flip chip bumping technologies at its facility in Phoenix, Arizona.
FlipChip International has opened a Reliability & Design centre for wafer level packaging (WLP) and flip chip bumping technologies at its facility in Phoenix, Arizona. FlipChip provides merchant WLP and flip chip bumping technology to the semiconductor market through its Phoenix facility and six global licensees.

This Reliability & Design centre will support FlipChip's design wins for radio-on-chip, wireless and broadband semiconductor devices for next generation video phones and wireless sensors. FlipChip has installed in-house testing within the Reliability and Design centre to support internal and external customers' needs for accelerated tests and analysis of devices and packages.

The centre has facilities for electromigration testing, temperature cycling and autoclave chambers. Analysis capabilities include Fourier transform infrared (FTIR), DSC, ultraviolet-visible (UV-VIS) spectroscopy for material characterisation, wet lab, cross sectioning, x-ray & optical inspection and scanning electron microscope energy dispersive x-ray spectroscopy (SEM/EDX).

The Freescale Digital Systems Laboratory was officially opened at Texas A&M University. The lab is located in the Department of Engineering Technology and Industrial Distribution within the Dwight Look College of Engineering. The lab covers an area of 140m2. The facility plans to research advanced semiconductor testing methodologies and embedded processor systems development.

Freescale provided a cash donation of $150,000 and helped secure equipment donations in excess of $400,000. Motorola contributed another $60,000 through the Motorola Foundation. These funds support lab equipment, facility renovations, curriculum development and student scholarships.

The lab will be divided into two parts. The research part includes two testers: one donated by Freescale and the second by Teradyne. The academic part hosts two undergraduate courses for sophomore students and beyond, with a third course planned.

Total Fab Solutions (TFS), a US supplier of CMP outsourcing services and CMP-related equipment, has secured an additional line of credit from Irwin Union Bank to fund expansion of its CMP foundry capacity.

Rob Rhoades, CTO of TFS, comments: "These new capabilities allow our customers to outsource their most advanced production CMP processes or to fully characterise new processes and materials before going into a production."

The US Securities and Exchange Commission (SEC) is conducting an informal inquiry into trading in the securities of Amkor. The company believes that the inquiry relates to transactions in the company's securities by certain individuals, which may include certain insiders, during 2004.

In connection with the informal inquiry, the company has received requests from the SEC to voluntarily produce documents and other relevant information concerning these matters. Amkor says that it is co-operating with these requests.

The SEC has advised Amkor that the inquiry should not be construed as either an indication by the SEC that any violations of law have occurred, or as an adverse reflection upon any person, entity or security. Amkor provides contract semiconductor assembly and test services.

Rasa Industries is to build a 300mm silicon wafer reclaim plant in Sanbongi, Japan. Construction is due to complete in April 2005. The JPY3.5bn ($31.8mn) investment is expected to result in a capacity of 30,000 units per month. The company plans to staff the plant with 50 people.

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