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Intellectual property

Novellus is to pay Semitool $2.9mn under a settlement of patent litigation in the US Oregon district court.
Novellus is to pay Semitool $2.9mn under a settlement of patent litigation in the US Oregon district court. The settlement agreement provides for the resolution of all outstanding patent claims. Semitool released Novellus for any past, but not future, infringement of its seed layer enhancement patent, and Novellus released Semitool for any past and future infringement of its various counterclaim patents. The settlement agreement does not include any license of either party's patents or technology. Semitool and Novellus will jointly dismiss the patent infringement litigation brought in the district court.

Ray Thompson, chairman and CEO of Semitool, remarks: "Semitool has developed and patented a seed layer enhancement technology that enables a reduction of physical vapour deposition layer thickness by as much as 75%. In conjunction with other Semitool semiconductor wafer process technology, seed layer enhancement produces higher interconnect yield and improved device performance at lower cost per wafer. We believe our seed layer enhancement technology is a competitive advantage and, therefore, we will protect our patents. To date, we have successfully finalised license agreements with Applied Materials and Ebara, and this settlement agreement with Novellus puts this litigation completely behind us."

Renesas Technology filed a motion for a preliminary injunction (a "Kari-Shobun" in Japan) against Nanya Technology in the Tokyo district court. Renesas is seeking the suspension of Nanya Japan's importation, marketing and sales of semiconductor memory products that Renesas believes infringe its semiconductor package-related patents. Nanya is a Taiwan based corporation specialising in semiconductor memory products.

Renesas Technology previously filed patent infringement lawsuits in the US North California district court on December 17, 2003. The Tokyo action began February 26, 2004.

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