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Ricoh will use UMC's L90 Standard Performance (SP) process device option with low-k dielectrics for next generation ASIC and image processor product lines.
Ricoh will use UMC's L90 Standard Performance (SP) process device option with low-k dielectrics for next generation ASIC and image processor product lines.

UMC delivered its first 90nm customer chips in March of 2003. The foundry is currently fully qualified and in volume production for a number of 90nm customer products. UMC's 90nm process incorporates up to nine copper metal layers, triple gate oxide and a multiple Vt option.

The 90nm co-operation with Ricoh is considered a part of UMC's Japan (UMCJ) business operations and earnings will be counted as UMCJ revenue. UMCJ will use UMC's technology and manufacturing through an outsourcing arrangement.

Mykrolis has shipped four gas purification systems to a "major" epi-wafer manufacturer located in Tainan, Taiwan. The systems will be used to purify nitrogen, hydrogen and ammonia used in the production of light emitting diode (LED) chips and will be installed this month.

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