News Article
Packaging
Agere Systems says that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
Agere Systems says that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
Company research found a tin-nickel combination in semiconductor packaging that mitigates the "tin whisker" problem and improves long-term reliability of lead-free devices. A layer of nickel between the layers of tin and copper has been found to reduce tin whisker growth.
Lead-free semiconductor packaging is due to be required by the European Union in just over a year, but is expected to be implemented globally in nearly every semiconductor package produced.
