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Process development

FEI has released its first DualBeam mask repair system aimed at the 65nm node.
FEI has released its first DualBeam mask repair system aimed at the 65nm node. The Accura XT+ tool combines a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM) in a single system.

The company also believes that the equipment can be extended to a broad set of next-generation lithography technologies including extreme ultraviolet (EUV) reflective masks, low-energy electron-beam lithography (LEEPL) stencils, nanoimprint and new absorber stacks.

FEI is also looking to sell the tool in combination with its SNP XT stylus nanoprofilometer with Rapid CD. The SNP XT identifies and maps mask defects and confirms repair by acquiring detailed 3D topographical data, particularly for alternating aperture phase shift (AAPSM) mask repair.

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