Mergers & acquisitions
Amkor Technology has completed its acquisition of Unitive in North Carolina together with a majority interest in Unitive Semiconductor Taiwan (UST) for $48mn. Amkor made an initial payment of $32 million and will pay the $16 million balance in one year. Amkor will also assume $23mn in debt. Performance based earn-outs could reach $57mn. Amkor acquired 60% of UST and 93% of Unitive. The remaining 7% of Unitive is to be acquired in a subsequent restructuring already included in the purchase price. Unitive and UST provide wafer level technologies and services for flip chip and wafer level packaging. Unitive and UST will operate as subsidiaries of Amkor. The deal gives Amkor technology for electroplated wafer bumping and turnkey wafer level chip scale packaging, together with installed and operationally qualified, high volume 200mm and 300mm electroplated wafer bumping and wafer level packaging operations.
ChipMOS has agreed to purchase all of the testing and assembly assets in Taiwan of First International Computer Testing and Assembly Technology (FICTA). The transaction is valued at approximately TWD1.1bn ($30mn) and is expected to close after FICTA has received approval from its shareholder. The assets include wafer testers, final testers and assembly equipment for memory products. SJ Cheng, chairman and CEO of ChipMOS, comments: "This transaction is expected to expand our capacity for the assembly and testing of memory semiconductors by 12mn pieces monthly."
