Oki debuts first MEMS chip
The company is looking for design wins in the mobile phone, mobile equipment, hard disk drive (HDD) and entertainment markets. Sample shipments are due in Japan and North America in October 2004 and volume shipments in April 2005. The micromachined sensor is built on silicon on insulator (SOI) wafers. The control IC chip is equipped with a signal amplification circuit, a control circuit, an analogue/digital converter and a temperature compensating circuit.
This is Oki's first product for the MEMS market, in which it has been providing production services using its silicon micro fabrication technology since 1999. Oki plans to reach sales of JPY10bn by the fiscal year ending March 2007 through its MEMS technology and development of sensors integrated with control ICs.
