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Mergers & acquisitions

Cypress Semiconductor has closed its $100mn acquisition of FillFactory, a Belgium-based spin-off from the European IMEC research centre (Bulletin 538, June 23, 2004).
Cypress Semiconductor has closed its $100mn acquisition of FillFactory, a Belgium-based spin-off from the European IMEC research centre (Bulletin 538, June 23, 2004). Cypress expects FillFactory's active-pixel CMOS image sensor technology to effectively double its sales into the cell phone market - there Cypress already sells low-power memories - and to augment its penetration of additional market segments, including digital still cameras (DSCs) and automotive.

TJ Rodgers, Cypress president and CEO, reports: "FillFactory's first Cypress-manufactured product will be made directly on our RAM8 CMOS process. Cypress's MicroPower processes are very well suited for image sensors."

FillFactory manufactures a range of products, such as a 13.85Mpixel device for Kodak professional cameras, a mammography sensor and radiation-tolerant products for use in aerospace applications.

ASM International (ASMI) has completed acquisition of Genitech, a semiconductor equipment supplier based in South Korea, for $5.2mn in cash and $4mn in ASMI common shares (Bulletin 529, April 28, 2004). ASM will also pay up to $9.2mn in cash over the next five years, depending upon the achievement of performance targets.

Arthur del Prado, president and CEO of ASMI, comments: "Genitech's Plasma Enhanced Atomic Layer Deposition (PEALD) provides complementary solutions to ASMI's own pioneering Atomic Layer Chemical Vapour Deposition (ALCVD) technology. Genitech's Cu Superfill CVD addresses the need for atomic control of copper deposition without PVD, which will be critical for smaller device geometries, 45nm and beyond.

"In addition, we believe ALD barriers and Cu Superfill CVD offer the ideal surface preparation for recently-acquired NuTool ECMD technology on our Aurora low-k film."

ST Assembly Test Services (STATS) and ChipPAC have completed their merger with shareholders from both companies agreeing to the deal.

Each share of ChipPAC Class A common stock has been converted into the right to receive 0.87 STATS American Depositary Shares, each of which represents the right to receive ten ordinary STATS shares. In the transaction, STATS issued to ChipPAC stockholders some 86.19mn STATS ADSs, representing 861.88mn STATS ordinary shares.

As a result of the merger, the name of the new company will be STATS ChipPAC Ltd. ChipPAC will continue operations as a wholly owned subsidiary. The new company is headquartered in Singapore. The merged company's R&D base now consists of more than 250 engineers.

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