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UK IC producer Zetex Semiconductors has bought Escend Technologies' design-win management enterprise software for semiconductor and electronic component manufacturers.
UK IC producer Zetex Semiconductors has bought Escend Technologies' design-win management enterprise software for semiconductor and electronic component manufacturers. Zetex supplies analogue semiconductors for signal processing and power management. The software is designed to help achieve growing revenues, improved global tracking of business opportunities and customer support during the design-in cycle.

Zetex will deploy the Escend system throughout its direct sales, field technical support, marketing and operations personnel, as well as to its outsourced sales representative partner organisations. The software will replace Zetex's existing regional tracking systems, quoting tools and processes. The application will also be integrated into the company's enterprise resource planning (ERP) system to create a closed-loop demand- and supply-chain system. The hope is to link opportunities and quotes to sales orders and expand the company's business planning and analytics.

Unaxis Wafer Processing has entered a three-year agreement to sub-contract all manufacturing activities at St Petersburg, Florida, to Electro Mechanical Solutions (EMS). EMS is a local, contract manufacturer specialising in the design, fabrication and assembly of high technology equipment for OEMs in semiconductor processing, medical, pharmaceutical and military applications.

Solvay Fluor und Derivate is to supply hydrofluoric acid 50% VLSI to Merck Electronic Chemicals. The HF will be used as starting material for concentrated and diluted HF and HF-based mixtures (BOE, Sioetch, Spinetch, other mixtures and ammoniumfluoride 40%) for the semiconductor industry.

Altera is using Shin-Etsu Chemical's thermally conductive interface gel material in the packaging for the high-end 90nm Stratix II field-programmable array (FPGA) family. Shin-Etsu's highly thermally conductive gel material facilitates rapid heat transfer from integrated circuit (IC) packages.

Tarun Verma, director of package engineering at Altera, adds: "Shin-Etsu's material exhibits excellent thermal characteristics, and its low modulus helps absorb stress between the integrated heat spreader in the package and pressure sensitive-low-k dielectric material in the silicon."

Motorola issued a statement regarding a software "issue" (i.e. the system doesn't work as specified) affecting assisted global positioning satellite (A-GPS) location services for certain handsets using technology from SiRF, a supplier of semiconductor and software products. Motorola and SiRF report that the SiRFstarIIe/LP chipset, SiRFstarII/IP core and SiRFLoc Multimode A-GPS software module, incorporated in these Motorola phones, has been operating as designed. Rather, the software issue is in the interface between the SiRF software module and the Motorola handsets. Motorola and SiRF say that they have identified a solution currently under test for deployment through their operator customers.

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