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Tokyo Electron (TEL), has selected Rudolph Technologies as a supplier for next- generation integrated macrodefect inspection solutions.
Tokyo Electron (TEL), has selected Rudolph Technologies as a supplier for next- generation integrated macrodefect inspection solutions. Rudolph's i-MOD ADI (after develop inspection) module is designed to be integrated into TEL CLEAN TRACK photolithography coater/developer systems. The equipment enables real-time macrodefect inspection of the entire surface of 300mm wafers at production throughputs.

Rob Loiterman, senior vice president of technology, Rudolph Technologies, comments: "By incorporating macrodefect inspection directly onto these lithography track tools, manufacturers can minimise the number of misprocessed wafers and accelerate process development and ramp with virtually instantaneous defect detection."

Mattson Technology has won multi-product system orders from Hynix Semiconductor. Hynix will use the tools to produce dynamic random access memory (DRAM) devices in its new T1 300mm wafer fabrication plant in Ichon, South Korea. Mattson's new Helios rapid thermal processing (RTP) and multiple Aspen III plasma tools, including the Aspen III ICPHT Strip system, are expected to be installed in Hynix' new fab for its 300mm pilot line by the end of August 2004.

Cognex has received a single purchase order in excess of $2mn from Accretech, a Japanese manufacturer of semiconductor processing equipment. The purchase order is for Cognex vision systems to be delivered over the next few months and is in addition to the more than $7mn in orders that Cognex had previously received from Accretech this year. Accretech will integrate the Cognex vision systems into its wafer probers to perform alignment and inspection tasks on silicon wafers.

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