Investment & expansion
Doron Simon, president of Tower USA, comments: "We have proven silicon and stable yield performance at Motorola's fab and our team has begun transferring the technology to Tower. We are now qualifying initial implementation partners (IPs) and are in discussions with lead customers for ramping this technology node at Tower's Fab 2."
The advanced system purchases include a 193nm scanner, as well as additional tools intended for all-copper process technology with the capability to manufacture 0.13micron and below technology nodes.
Including previously ordered tools to increase 0.18micron production capacity for Fab 2 and the initial ramp of 0.13micron capacity, Tower expects capital equipment expenditure to be between $150mn and $200mn this year.
AMI Semiconductor has expanded its mixed-signal semiconductor design and support capabilities with the opening of a new design centre in Sofia, Bulgaria. AMIS will use the Sofia site to develop and support mixed-signal integrated circuits for automotive, industrial and consumer applications. The engineering team has expertise in mixed-signal semiconductor devices, including those for integrated sensors.
FlipChip International is to expand by 45% its wafer level packaging capacity in Phoenix, Arizona, between now and the end of the year. The Spheron packaging line in particular is due to double its output. This line is aimed at radio-on-chip and broadband devices for next generation video phones and wireless sensors. Spheron uses advanced low-k polymer build-up and proprietary FCI processes with a 0.4mm pitch.
