News Article
Packaging
Tessera Technologies has signed an IC packaging licensing agreement with NEC Electronics.
Tessera Technologies has signed an IC packaging licensing agreement with NEC Electronics. NEC Electronics uses Tessera's technology in application specific integrated circuits (ASICs), application specific standard products (ASSPs) and logic devices.
The technology available to NEC Electronics covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in face-down, face-up, fold-over, stacked and system-in-package (SiP) formats. These package types are marketed by Tessera as MicroBGA for facedown, MicroBGA-F for face-up and MicroZ for multi-chip solutions.
