Alliances
The SMIA has six chapters:
* Electrical interface for the physical layer (voltage levels, pin-count, timing), data rate (up to 650Mb/sec), EMI (electro-magnetic interference) performance and output image format
* Functional specification for frame and field formats, register maps for set-up and control along with three profiles to help easy video usability with high resolution sensors
* Mechanical interface with a family of modules that provide outlines specifically designed for volume manufacturing
* Characterisation for optical-performance metrics and sensor noise standards
* Reliability including environmental-test and drop-test standards
* Software model including reference device drivers and architecture "Nokia recently estimated that the camera phone market would exceed 200mn units this year," reports Janne Haavisto, Nokia director for camera techology. "SMIA's target is to streamline and accelerate the camera module development, ultimately contributing to creation of the state-of art imaging mobile devices, independent of vendors."
"ST and Nokia have worked on this specification for more than two years and both companies are contributing significant intellectual property into SMIA," adds Marc Vasseur, general manager of ST's Imaging division. "ST has been immensely successful in this market due to best-in-class pixel performance, sensor and module development capabilities, and full ownership of the manufacturing flow."
Nokia and ST hold key patents and other intellectual property in the SMIA specification, but both companies have decided to open these up to any third party and will not assert those rights against anyone implementing a fully compliant SMIA module. No fee or royalty will be levied. A simple license form can be found on.
Toppan Printing of Japan and China's Semiconductor Manufacturing International (SMIC) foundry have agreed to form a joint venture company in China to manufacture and sell on-chip colour filters and microlens assemblies for image sensors. This is claimed as the first company in China to develop and provide manufacturing services for such technology. The parties plan to formalise the details of the joint venture in the near future.
Toppan Printing develops on-chip colour filters. SMIC has been developing CMOS image sensor (CIS) front-end process technology and is planning to enter into the image sensor market.
Cabot Microelectronics has entered into a strategic alliance with NanoProducts, a developer of nanoscale particles and related nanotechnology products. As part of the alliance, Cabot Microelectronics and NanoProducts will collaborate to develop nanoscale powders and particles for use in fine finish polishing applications, including chemical mechanical planarisation (CMP) slurries. In addition, Cabot Microelectronics has obtained a minority equity stake in NanoProducts for an investment of $3.75mn.
The alliance strengthens a joint development relationship between the parties that has been ongoing since 2002, and provides that NanoProducts will work exclusively with Cabot Microelectronics in developing its technology in the area of CMP. The agreement has an initial term of three years, and is renewable.
