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Sales & orders

Taiwan based Siliconware Precision Industries (SPIL) has ordered lithography systems and coat/bake/develop tracks from SUSS MicroTec.

Taiwan based Siliconware Precision Industries (SPIL) has ordered lithography systems and coat/bake/develop tracks from SUSS MicroTec. SPIL is one of the world's largest semiconductor packaging and testing companies. This new business represents additional follow-on 300mm business from this customer.

The order includes SUSS' MA300Plus 1X full-field lithography systems (1XFFL) and ACS300Plus wafer-processing cluster, in support of 300mm production ramping at SPIL's advanced wafer bumping facility in Taiwan. The shipments include key elements of SUSS' SupraYield technology. Installations will begin in Q2 2004.

SUSS has also received an additional lithography order from another Taiwan company, XinTec. The order adds a 200mm 1XFFL exposure (1X full-field lithography) tool. XinTec will use the system for production of Shellcase's wafer-level chip size packaging (CSP) technology. The 1XFFL exposure systems are designed to align and expose the entire wafer in one step leading to a significant reduction of process cycle time.

The 200mm Altis Semiconductor fab in France has qualified Mykrolis' Fluorogard RS product line for photochemical stripping. The Fluorogard RS-M achieved a filter time of two months - four times longer than the previous filter, reducing tool downtime caused by bath contamination. Altis is a joint venture between IBM and Infineon.

Molecular Imprints (MII) has bought Cimetrix software (CIM300 and CIM300Expert) for testing 300mm compliance and implementation of semiconductor equipment. Molecular Imprints provides step and flash imprint lithography systems that are seen as a possible future solution to nanometre patterning. Applications are seen in making nano devices, micro structures, advanced packaging, bio devices, optical components and semiconductor devices.

CIM300 supports the SEMI standards E39, E40, E58, E87, E90, E94 and E116 and can be used with existing GEM interfaces. Its modular architecture allows the equipment supplier the flexibility to implement one or more of the connectivity standards. Each module has its own COM/DCOM interface and  supports the development of multi-threaded applications.

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