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Process development

Ultratech introduced the LSA100 laser spike anneal system - the first tool built on the company's new Unity Platform for laser and lithography applications.

Ultratech introduced the LSA100 laser spike anneal system - the first tool built on the company's new Unity Platform for laser and lithography applications.

The LSA 100 tool features the company's patented laser-processing (LP) technology rolled out last year. Ultratech claims the LSA100 as one of the industry's first commercially available laser- processing systems for both development and volume production of 65nm and smaller devices down at least to the 20nm technology node. The hope is that the LSA100 will help IC manufacturers improve both the speed and density of their next- generation chips by minimising thermal diffusion and greatly enhancing dopant activation. The LSA100 can ramp localised temperatures up to 1412degreesC in micro- to milliseconds.

Hardware design features enable outstanding temperature uniformity across the wafer and die by minimising the pattern-density effect, thus reducing absorption variations within a typical die to less than 2%. Such properties for the anneal process are vital to forming the ultra-shallow junctions needed for high-functioning transistors. LP enables elevated temperatures for near-instantaneous annealing of both contact and implant layers - without impacting the thermal budget.

The process results also demonstrate that Ultratech's LP technology is relatively insensitive to device and wafer-pattern densities, which Ultratech believes is essential to facilitating the integration of this new technology into a host of diverse manufacturing environments. Ultratech believes that it is the first semiconductor-equipment manufacturer to offer a commercially viable LP system that delivers proven and published process results. Since last year, Ultratech has recognised revenue for several development and pre-production units and is working closely with leading chipmakers to speed and simplify process integration. Ultratech has more than 65 LP patents awarded or pending.

Ultratech has received multiple commitments for its LSA100 systems scheduled for shipment this year and is now accepting production orders for systems expected to ship during 2005.

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