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Process development

Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.

Toshiba has launched the industry's first commercial system-on-chip (SoC) devices built on the X Architecture design based on the inclusion of diagonal chip interconnects alongside the more traditional right angle wiring.

The TC90400XBG chip produced on a 130nm process validates the benefits of the X Architecture by delivering a powerful, compact and highly integrated solution for next generation digital video broadcast and multimedia home-entertainment applications. Compared to equivalent Toshiba products with the conventional "Manhattan" design, the new X Architecture chip is approximately 11% faster in speed and 10% smaller in random logic area.

Samples of the new chip will be available in November 2004 and mass production is expected to begin in Q2 2005. Toshiba has already won its first customer for TC90400XBG - the chip will be integrated into digital TVs, initially in products for the European market.

Toshiba and electronic design automation supplier Cadence collaborated on the development of the X Architecture and are co-sponsors of the X Initiative, a consortium of more than 40 companies dedicated to facilitating the commercial adoption of the X Architecture by preparing the design chain for volume production.

Leica Microsystems has used immersion optics in its new deep ultraviolet (DUV) AT WI objective to obtain 60nm resolutions with an assembly consisting of 19 lenses. A small drop of water is applied between the object, such as a photomask, and the objective, acting as an immersion medium. As the refractive index of water is higher than that of air and a higher refractive index increases resolution - the new objective offers 25% more resolution performance than the predecessor model.

Xilinx and UMC claim the industry's first FPGA products manufactured using 90nm triple-oxide technology. "Triple oxide" refers to the use of three different thicknesses of insulating gate oxide layers to lower static and dynamic power consumption. The companies were thus able to break the traditional trade-off between power consumption and performance.

The resulting devices are expected to use up to 50% less power compared with the previous generation devices produced in Xilinx' Virtex-4 platform FPGA family. Xilinx has already received initial wafers from UMC using the triple-oxide 90nm technology.

UMC and Xilinx delivered the first 90nm FPGAs in March 2003. UMC is now in volume production for various 90nm products including the Xilinx Spartan-3 family of FPGAs.

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