Packaging
Advanced Interconnect Technologies (AIT) has fully qualified a complete green flip-chip small outline IC (FC-SOIC) narrow body package that meets OEM requirements for the MSL1 moisture and 260degreesC temperature packaging standards. These high-performance packages are claimed as the industry's first to use pillar bumping technology from Advanpack Solutions.
AIT's green package is in compliance with the European Commission, US Environmental Protection Agency and Japan Electronic Industry Development bans on the use of lead, mercury cadmium hexavalent, chromium and PBB PBDE chemicals.
The packaging does not require any precious metals, and features sealed bond pads, alpha particle protection, and higher temperature tolerance for faster assembly and lower manufacturing costs. The FC-SOIC packages are manufactured at AIT's factory in Batam, Indonesia, and the company says that it is now ready for full production.
