News Article
Product Reviews - BOC Edwards
WESP (Wet Electro-static Precipitator)
Efficient removal of particles from semiconductor process exhausts, especially 300 mm CVD, is important to minimize the risk of blockages in customer exhaust ducts. BOC Edwards has developed the Wet Electro-static Precipitator (WESP) to efficiently remove particles downstream of a process chamber abatement device. The WESP transfers the particles into a water stream without generating significant backpressure and can be used in conjunction with most abatement devices.
Efficient removal of particles from semiconductor process exhausts, especially 300 mm CVD, is important to minimize the risk of blockages in customer exhaust ducts. BOC Edwards has developed the Wet Electro-static Precipitator (WESP) to efficiently remove particles downstream of a process chamber abatement device. The WESP transfers the particles into a water stream without generating significant backpressure and can be used in conjunction with most abatement devices.
iGX 10/100 Drypump
The iGX Dry Vacuum Pump Series provides a versatile vacuum pump platform with reliable performance for clean to medium-duty silicon and compound semiconductor applications. Compact size and low vibration allow great flexibility, iGX pumps can be used for on-tool, proximity or remote installations – in turn, ensuring space savings and ultimately reduced overall cost of ownership. The iGX platform offers substantial utilities savings with a unique Active Utility Control (AUC), long service intervals and zero maintenance between planned overhauls. The new iGX 10/100N provides high-performance pumping capability for ashing, etch and large transfer chambers yet offers the lowest utility consumption* in a small footprint.
* As compared with available published data on comparable semiconductor dry vacuum pumps.
iSIS™ - Slurry Blending and Delivery
The BOC Edwards iSIS 1100, iSIS 1200, and iSIS 2000 CMP slurry blending and delivery systems offer integrated centrifugal pump technology for dispensing slurry to a global loop feeding CMP polishers. This centrifugal pump technology provides additional global loop pressure control to minimize pressure fluctuations at the point-of-use during demand fluctuations, thereby enabling consistent polishing rates and improving yield in the chemical-mechanical planarization process.
The iSIS systems blend concentrated CMP slurry with DI water and up to three or four additional constituents via the BOC Edwards patented MassFusion™ load cell-based blending technology. The iSIS series, designed specifically for semiconductor CMP process support, is available in several configurations including the patented i4™ pressure dispense, bellows pump, or centrifugal pump dispense engine.
iTCU 40/90 Chiller
The iTCU 40/90 Chiller is the next generation of temperature control from BOC Edwards, continuing and improving upon the ten-year history of the high-performing TCU series. The single-channel temperature control unit answers the needs of advanced semiconductor manufacturing processes for solid temperature stability, auto-tuning to facility conditions, logging of all control parameters, factory connectivity, and ease of use. The easily-maintained iTCU 40/90 Chiller reliably cools electrostatic chucks, quartz windows, and chamber walls. The use of non-conductive perfluorocarbon coolant eliminates the need for resistivity concerns when used with large plasma or magnetic fields.
BOC Edwards
The iGX Dry Vacuum Pump Series provides a versatile vacuum pump platform with reliable performance for clean to medium-duty silicon and compound semiconductor applications. Compact size and low vibration allow great flexibility, iGX pumps can be used for on-tool, proximity or remote installations – in turn, ensuring space savings and ultimately reduced overall cost of ownership. The iGX platform offers substantial utilities savings with a unique Active Utility Control (AUC), long service intervals and zero maintenance between planned overhauls. The new iGX 10/100N provides high-performance pumping capability for ashing, etch and large transfer chambers yet offers the lowest utility consumption* in a small footprint.
* As compared with available published data on comparable semiconductor dry vacuum pumps.
iSIS™ - Slurry Blending and Delivery
The BOC Edwards iSIS 1100, iSIS 1200, and iSIS 2000 CMP slurry blending and delivery systems offer integrated centrifugal pump technology for dispensing slurry to a global loop feeding CMP polishers. This centrifugal pump technology provides additional global loop pressure control to minimize pressure fluctuations at the point-of-use during demand fluctuations, thereby enabling consistent polishing rates and improving yield in the chemical-mechanical planarization process.
The iSIS systems blend concentrated CMP slurry with DI water and up to three or four additional constituents via the BOC Edwards patented MassFusion™ load cell-based blending technology. The iSIS series, designed specifically for semiconductor CMP process support, is available in several configurations including the patented i4™ pressure dispense, bellows pump, or centrifugal pump dispense engine.
iTCU 40/90 Chiller
The iTCU 40/90 Chiller is the next generation of temperature control from BOC Edwards, continuing and improving upon the ten-year history of the high-performing TCU series. The single-channel temperature control unit answers the needs of advanced semiconductor manufacturing processes for solid temperature stability, auto-tuning to facility conditions, logging of all control parameters, factory connectivity, and ease of use. The easily-maintained iTCU 40/90 Chiller reliably cools electrostatic chucks, quartz windows, and chamber walls. The use of non-conductive perfluorocarbon coolant eliminates the need for resistivity concerns when used with large plasma or magnetic fields.
BOC Edwards
