SEMI report looks at Chinese manufacturing trends
SEMI has released a report that shows the Chinese semiconductor market is increasing faster than the rest of the world with 300mm wafers already being tested well before predictions based on external restrictions placed upon the countrys technological growth.
In 2004, new semiconductor equipment sales in mainland China reached US$2.73 billion; used/refurbished equipment sales are estimated at US$180 million; fab materials sales totaled US$391 million; and the packaging materials market reached US$781 million, according to the report.
China's semiconductor manufacturing is a relatively small share of the world total, but the number of new fabs and packaging plants are increasing relative to other market regions. The report indicates that twenty new fabs are expected to be built in China between 2005 and 2008, with many of the projects to be equipped with used and refurbished equipment.
Furthermore, the number of silicon wafers consumed in China increased dramatically, while the first 300 mm fab began pilot production in 2004.
The installed Chinese 200 mm and 300 mm wafer capacity at the end of 2004 was equivalent to 106 million square inches (MSI) per year. Chinese equipment companies and related institutes are now lobbying the central government to invest in research and development for high-end tools such as steppers and etchers for 90 nm node/300 mm processing.
Estimated Silicon Wafer Consumption in China
(Annual Wafer Consumption)
Diameter 2003 2004 Percent Growth
100 mm or smaller 2,250,000 2,750,000 22%
125 mm 880,000 1,150,000 31%
150 mm 1,610,000 2,780,000 73%
200 mm 860,000 1,700,000 98%
