News Article
STATS Chip PAC Intro to Sub 0.50mm Profiles Packaging
STATS ChipPAC Ltd. a semiconductor test and advanced packaging service provider announced it has added a new family of extremely thin packaging solutions with profile heights of less than 0.50mm to its packaging portfolio.
STATS ChipPAC Ltd. a semiconductor test and advanced packaging service provider announced it has added a new family of extremely thin packaging solutions with profile heights of less than 0.50mm to its packaging portfolio.
Space constrained portable electronics such as cell phones, mini disk drives, and miniaturized consumer electronics are driving the need for smaller and thinner packaging solutions to support low vertical profiles. While bare die solutions have typically been utilized for extremely thin profile requirements, STATS ChipPAC now provides semiconductor companies the option of using a substrate based molded package for the same applications. Unlike other extra thin package offerings, terminals can be arrayed across the bottom surface of the package, delivering higher input/output (I/O) in smaller form factors. These extra thin packages are able to accommodate die shrinks without changing the package footprint as well as integrate more than one device within the package, allowing for a very flexible packaging solution.
In order to achieve a maximum profile height of less than 0.50mm, STATS ChipPAC utilizes a 0.13mm two metal layer laminate substrate, wafer thinning down to 75 microns, advanced molding technology, and an optimized bill of materials to minimize warpage of the assembled package. STATS ChipPAC's extra thin design allows a full array of solder balls or lands on the substrate to deliver greater flexibility in (I/O), layout and density in a given package size. STATS ChipPAC's Extremely Thin Fine Ball Grid Array (XFBGA) package features a maximum height of 0.50mm while the Extremely Fine Land Grid Array (XFLGA) package achieves a maximum height of0.45mm. The technology to support larger ball sizes for XFBGA and two die stack for XFLGA is also available.
"We have taken our knowledge base in die stacking and applied key enabling technologies to develop an extra thin package offering for customers," said Scott Jewler, Chief Strategy Officer, STATS ChipPAC. "By combining conventional wire bond equipment and processes with advanced wafer thinning technologies, we are able to offer customers a leading-edge solution that still satisfies the cost sensitive demands of consumer applications."
XFBGA and XFLGA packages are available in single or multiple die solutions utilizing lead free material sets (including low alpha materials), with or without eutectic or lead free solder balls. STATS ChipPAC has currently qualified up to two die in a side-by-side configuration. Additional die configurations are possible based on the application requirements.
Space constrained portable electronics such as cell phones, mini disk drives, and miniaturized consumer electronics are driving the need for smaller and thinner packaging solutions to support low vertical profiles. While bare die solutions have typically been utilized for extremely thin profile requirements, STATS ChipPAC now provides semiconductor companies the option of using a substrate based molded package for the same applications. Unlike other extra thin package offerings, terminals can be arrayed across the bottom surface of the package, delivering higher input/output (I/O) in smaller form factors. These extra thin packages are able to accommodate die shrinks without changing the package footprint as well as integrate more than one device within the package, allowing for a very flexible packaging solution.
In order to achieve a maximum profile height of less than 0.50mm, STATS ChipPAC utilizes a 0.13mm two metal layer laminate substrate, wafer thinning down to 75 microns, advanced molding technology, and an optimized bill of materials to minimize warpage of the assembled package. STATS ChipPAC's extra thin design allows a full array of solder balls or lands on the substrate to deliver greater flexibility in (I/O), layout and density in a given package size. STATS ChipPAC's Extremely Thin Fine Ball Grid Array (XFBGA) package features a maximum height of 0.50mm while the Extremely Fine Land Grid Array (XFLGA) package achieves a maximum height of0.45mm. The technology to support larger ball sizes for XFBGA and two die stack for XFLGA is also available.
"We have taken our knowledge base in die stacking and applied key enabling technologies to develop an extra thin package offering for customers," said Scott Jewler, Chief Strategy Officer, STATS ChipPAC. "By combining conventional wire bond equipment and processes with advanced wafer thinning technologies, we are able to offer customers a leading-edge solution that still satisfies the cost sensitive demands of consumer applications."
XFBGA and XFLGA packages are available in single or multiple die solutions utilizing lead free material sets (including low alpha materials), with or without eutectic or lead free solder balls. STATS ChipPAC has currently qualified up to two die in a side-by-side configuration. Additional die configurations are possible based on the application requirements.
