News Article
Deposition Equipment Market tipped for 2006 Growth
The semiconductor thin-film equipment market will trend upward starting in mid-2006 and reach double-digit growth in 2007 and 2008, aided by transistor and gate processing...
The semiconductor thin-film equipment market will trend upward starting in mid-2006 and reach double-digit growth in 2007 and 2008, aided by transistor and gate processing, according to the report “Thin Film Deposition, Trends, Key Issues, Market Analysis,” recently published by The Information Network, market research company.
“Significantly more equipment will be needed to process the transistor at 65nm versus 130nm,” noted Dr. Robert N. Castellano, President of The Information Network. “For example, it will take 17 implant tools versus only 7 for the Ultra-shallow Junctions. For the Strained SiGe Source/Drain, 5 Epi reactors, 2 etch, and 2 clean tools will be required at 65nm for a process that was not even implemented at 130nm. For the Gate Stack, 5 integrated tools will be required versus only 1 oxidation furnace and 1 poly furnace.”
For Gate Stack processing, the equipment market was $278 million in 2004. Applied Materials led the market with a 55.9% share, followed by TEL with a 30.1% share and ASM with a 9.6% share.
The worldwide market size for CVD was $2.48 billion in 2004, up 72.6% from $1.44 billion in 2003 and growing to $3.27 billion in 2008. Revenues decreased 21.4% in 2003 to $1.44 billion and will drop 9.3% in 2005. Excessive capacity build up in 2004 will result in negative growth in 2005 and 2006.
Novellus led the metal CVD market in 2004 with a 50.0% share, while Applied Materials share increased from 58.1% in 2003 to 65.1% in 2004 in the dielectric CVD market.
The worldwide market size for PVD was $1,525 million in 2004, up 91.8% from $795 million in 2003 and growing to $2,031 million in 2008. Applied Materials held a lead in the PVD market in 2004 with a 90.0% share, up from an 84.3% share in 2003 and up from 81.9% in 2002.
“Significantly more equipment will be needed to process the transistor at 65nm versus 130nm,” noted Dr. Robert N. Castellano, President of The Information Network. “For example, it will take 17 implant tools versus only 7 for the Ultra-shallow Junctions. For the Strained SiGe Source/Drain, 5 Epi reactors, 2 etch, and 2 clean tools will be required at 65nm for a process that was not even implemented at 130nm. For the Gate Stack, 5 integrated tools will be required versus only 1 oxidation furnace and 1 poly furnace.”
For Gate Stack processing, the equipment market was $278 million in 2004. Applied Materials led the market with a 55.9% share, followed by TEL with a 30.1% share and ASM with a 9.6% share.
The worldwide market size for CVD was $2.48 billion in 2004, up 72.6% from $1.44 billion in 2003 and growing to $3.27 billion in 2008. Revenues decreased 21.4% in 2003 to $1.44 billion and will drop 9.3% in 2005. Excessive capacity build up in 2004 will result in negative growth in 2005 and 2006.
Novellus led the metal CVD market in 2004 with a 50.0% share, while Applied Materials share increased from 58.1% in 2003 to 65.1% in 2004 in the dielectric CVD market.
The worldwide market size for PVD was $1,525 million in 2004, up 91.8% from $795 million in 2003 and growing to $2,031 million in 2008. Applied Materials held a lead in the PVD market in 2004 with a 90.0% share, up from an 84.3% share in 2003 and up from 81.9% in 2002.
