sp3 to provide diamond film deposition at MEMS Exchange
sp3 Diamond Technologies, has been awarded a DARPA contract to introduce its nanoparticle diamond thin film deposition process into the MEMS Exchange. This will give MEMS developers the ability to make cost-effective use of the thermal, mechanical and wear benefits of diamond in their designs.
"We look forward to the formal introduction of sp3's diamond thin-film process," said Michael Huff, Director of the MEMS and Nanotechnology Exchange. "A diamond process is a significant addition to the many enabling processes already available to MEMS Exchange users."
sp3's award from DARPA covers a 10-month project in which the company will also transfer a nanoparticle seeding process developed by the Naval Research Laboratory into sp3's process flow. At the end of the project, sp3's diamond thin film deposition process will be available on 4-inch and 6-inch wafers through the DARPA supported MEMS Exchange. sp3 also has the ability to provide diamond thin films on 200-mm and 300-mm wafers.
"DARPA's support for the use of diamond thin films in MEMS devices, as evidenced by this contract, is a critical recognition of our technology," stated Dwain Aidala, president and COO of sp3 Diamond Technologies. "The properties of diamond make it an ideal material for use in MEMS devices where thermal and mechanical management issues are key. By reducing wear and stiction problems MEMS devices will perform better and last longer than devices manufactured with other materials."
