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News Article

STS has MEMS etching in sight

Surface Technology Systems (STS) has announced the release of Pegasus, a new Deep Reactive Ion Etching (DRIE) system, optimised initially for silicon etch, that delivers significant improvements in etch process capability, stability and system reliability.

Surface Technology Systems (STS) has announced the release of Pegasus, a new Deep Reactive Ion Etching (DRIE) system, optimised initially for silicon etch, that delivers significant improvements in etch process capability, stability and system reliability. The new tool is aimed at the MEMS market and with first orders from Bosch announced it is making its mark.

Pegasus is the continuation of STS’ Advanced Silicon Etch technology. Through an in-depth understanding of the Bosch process and the required hardware, etch rates for silicon greater than 25µm per minute with excellent profile control and resist selectivity have been realised. The performance improvements that Pegasus brings have numerous benefits for end users. The increased etch rate and improved uniformity lead to higher throughput and device yield, meaning increased productivity.

"The release of Pegasus is very significant news as it brings advanced processes to the MEMs market and also helps make those applications currently in research and development commercially viable," commented Leslie Lea, director of research and development at STS. "In emerging markets such as advanced wafer packaging, the higher selectivity and etch rate that Pegasus offers make the fabrication of through wafer interconnects viable. System-in-a-package (SiPs) incorporating MEMs, optoelectronics and bio chips can now be realised. As the electronics and technology industries move from applications using microtechnology to those using nanotechnology, Pegasus really comes into its own."

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