News Article
SUSS wafer bonder orders show global MEMS growth
SUSS MicroTec has received 3 purchase orders from leading device manufacturing companies for its production wafer bonder ABC200.
SUSS MicroTec has received 3 purchase orders from leading device manufacturing companies for its production wafer bonder ABC200. The orders, worth a total value of more than $4 million, were received in September and October and are follow-on orders due to capacity expansions. The systems are scheduled to be shipped by the end of this quarter and early next quarter and will be installed in Europe, North America and Taiwan respectively. The tools are being used for display and automotive applications in direct, triple stack anodic and thermal compression bonding processes.
Michael Kipp, General Manager for the Substrate Bonder Division at SUSS MicroTec commented: "We are delighted to receive these orders which further demonstrates that SUSS maintains its leadership position in the MEMS market. All of the purchases are repeat orders which is testimony to the reliability of the systems and the effectiveness of our world wide support structure"
The market for displays and image sensors are among the leading applications in the diversified MEMS market." said Markus Gabriel, the MEMS Manager at SUSS MicroTec. "New cost effective manufacturing processes and consumer demand have pushed this market segment into high volume production" explained Mr. Gabriel further.
Wafer bonding is a MEMS enabling technology and essential in many manufacturing cycles. Process knowledge and new technologies like ambient pressure plasma activation open up new design possibilities to MEMS manufacturers. This combined with expertise in mask and bond aligners results in processes optimized for combining MEMS with CMOS at wafer level. With this technology manufacturers achieve post bond alignment accuracies below 1 µm in production environments.
Michael Kipp, General Manager for the Substrate Bonder Division at SUSS MicroTec commented: "We are delighted to receive these orders which further demonstrates that SUSS maintains its leadership position in the MEMS market. All of the purchases are repeat orders which is testimony to the reliability of the systems and the effectiveness of our world wide support structure"
The market for displays and image sensors are among the leading applications in the diversified MEMS market." said Markus Gabriel, the MEMS Manager at SUSS MicroTec. "New cost effective manufacturing processes and consumer demand have pushed this market segment into high volume production" explained Mr. Gabriel further.
Wafer bonding is a MEMS enabling technology and essential in many manufacturing cycles. Process knowledge and new technologies like ambient pressure plasma activation open up new design possibilities to MEMS manufacturers. This combined with expertise in mask and bond aligners results in processes optimized for combining MEMS with CMOS at wafer level. With this technology manufacturers achieve post bond alignment accuracies below 1 µm in production environments.
