News Article
SUSS selected in Purdue University's Nanotechnology Centre
SUSS MicroTec has Announced Purdue University has purchased a SUSS Substrate Bonder and a MMask / Bond Aligner for use in Purdue's new Birck Nanotechnology Centre. Purdue University is recognized as one of the top 5 universities for the advancement of "Nano Education".
SUSS MicroTec has Announced Purdue University has purchased a SUSS Substrate Bonder and a MMask / Bond Aligner for use in Purdue's new Birck Nanotechnology Centre. Purdue University is recognized as one of the top 5 universities for the advancement of "Nano Education".
Purdue dedicated their new modernistic 187,000 square foot Birck Nanotechnology Center building on October 8, with the goal of positioning their institution as a leader in nanotechnology studies. This facility provides state-of-the-art laboratory environments and scientific equipment for nanoscale research that will be used by over 130 faculty and their students from 27 departments.
"We are proud to be a part of the further education and exploration into the nanotechnology field with the sale of these tools to Purdue University."; said Michael Kipp, General Manager for the Substrate Bonder Division at SUSS MicroTec. SUSS wafer bonder equipment was selected by Purdue to provide the necessary capabilities to further their research into wafer bonding applications in the field of nanotechnology.
Purdue dedicated their new modernistic 187,000 square foot Birck Nanotechnology Center building on October 8, with the goal of positioning their institution as a leader in nanotechnology studies. This facility provides state-of-the-art laboratory environments and scientific equipment for nanoscale research that will be used by over 130 faculty and their students from 27 departments.
"We are proud to be a part of the further education and exploration into the nanotechnology field with the sale of these tools to Purdue University."; said Michael Kipp, General Manager for the Substrate Bonder Division at SUSS MicroTec. SUSS wafer bonder equipment was selected by Purdue to provide the necessary capabilities to further their research into wafer bonding applications in the field of nanotechnology.
