EVG celebrates 15 years supplying high volume MEMS equipment
“MEMS technology driven by automotive, information technology and telecommunication applications has successfully matured from lab to fab,” says Mr. Thallner (CEO and founder of EVG). “For the past 25 years we have pioneered equipment technology, establishing equipment industry standards in MEMS. Currently we are enjoying the transition of MEMS processing technology to 300mm mainstream semiconductors. The era of ‘new-MEMS' has begun.”
During the past 15 years, hundreds of millions of MEMS devices have relied upon EVG equipment technology for automotive safety applications. Some of the highest reliability and yield requirements have helped perfect semiconductor equipment for applications in emerging wafer level packaging (WLP) technologies. The era of “new-MEMS” is set to take-on the semiconductor world with application improvements that go beyond and above Moore's Law.
“More-than-Moore” is the simplistic emphasis of the “new-MEMS” era bringing wafer bonding technologies from engineered substrates to emerging ultrathin wafer support and 3D interconnect technologies for RFID, power device and memory applications.
“New-MEMS” applications will provide a viable alternative to circumvent the “red-brick-wall” identified for future technology nodes in the International Technology Roadmap for Semiconductors (ITRS).
“25 years of innovation and development has matured EVG's equipment technology for high volume manufacturing and we would like to thank our partners for helping us to reach this milestone,” declared Mr. Thallner at his company's celebrations.
