Info
Info
News Article

Fujitsu Plans New 65nm Process Technology Fab

Fujitsu Limited announced that it will construct a new fab to mass-produce logic semiconductors employing leading-edge 65-nanometer (nm) process technology and 300 millimetre (mm) wafers.
Fujitsu Limited announced that it will construct a new fab to mass-produce logic semiconductors employing leading-edge 65-nanometer (nm) process technology and 300 millimetre (mm) wafers. The fab will be constructed at Fujitsu's Mie semiconductor plant, in Mie prefecture of central Japan, as the second 300mm fab of the plant and will be referred to as 300mm Fab No2, which will feature a dual-level clean room structure. Construction is scheduled within fiscal 2006 (April 2006 - March 2007) and will become operational from April 2007, with volume shipments expected to start from July 2007.

During the two-year period until the end of fiscal 2007, Fujitsu will invest approximately 120 billion-yen in the new fab and production capacity will reach 10,000 wafers per month. Further investments will be made in stages as the company evaluates trends in market demand. Fujitsu expects the maximum capacity of the facility will be 25,000 wafers per month.
Imagination Technologies Commits To The UK As It Looks To Accelerate Growth In New Areas Of Technological Innovation
Dow Launches Fast Curing Silicone Adhesive
Picosun And A*STAR’s IME To Create Novel, High Performance Memories
Picosun Reinforces Local Operations During The COVID-19 Epidemic
Imec Builds World’s First Spiking Neural Network-Based Chip For Radar Signal Processing
Efinix’s Trion FPGA Silicon Platform Expands Into Europe
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
Infineon Withdraws Outlook For FY20
ACM Research Launches Stress-Free Polishing Tool For Advanced Packaging Applications; Delivers First Tool To Leading Chinese OSAT
The AP&S Demo Center Will Help You. Request Your Wet Process Demonstration And Be Part Of It Live Via Video Chat.
Semiconductor Manufacturing: Achieving Water Authority Compliance
SUSS MicroTec Purchases The Inkjet Printer Division Of Meyer Burger B.V.
Park Systems Completes Equity Investment In Molecular Vista
Ereztech Expands US Footprint, Opens R&D Lab
SPTS Technologies Honored With Queen’s Award For Enterprise In Innovation 2020
Oxford Instruments’ Plasma Technology And NanoScience Businesses Collaborate With The Consortium
The ASM 306 S Helium And Hydrogen Sniffer Leak Detector For Easy And Accurate Full-time Sniffing Operations
Structural Defects In A TO-220
WEBINAR: Smart Manufacturing
Park Systems Announces $1 Million Dollar Nano Research Grant Fund
Intel Shines Amidst The Carnage Of The 2019 Semiconductor Market
Particle Measuring Systems Releases 20 Nm Syringe Sampler
Infineon Technologies AG Completes Acquisition Of Cypress Semiconductor Corporation
Picosun Group’s Strong Growth Continues In 2020

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}