SEMICON Europa to focus on the future
More than 750 companies will display the latest semiconductor manufacturing technologies, photovoltaics, micro-electromechanical systems (MEMS) and nanotechnology devices at the 30th annual SEMICON Europa exposition, which is set for 3-6 April at the Messe Muenchen International in Munich Germany. In addition to the exhibits, SEMICON Europa will feature a number of business and technical programs and events that will run concurrently at the Munich International Congress Centre (ICM) or at the Arabella Sheraton Munich on Monday, April 3.
"There is a great amount of potential for semiconductor innovation and R&D in Europe, and companies here have developed many outstanding technologies," said Heinz Kundert, president of SEMI Europe. "Celebrating its 30th year, SEMICON Europa continues to bring these companies together in a comprehensive forum that allows for topical discussion and showcasing new technologies, which ultimately helps lay the groundwork for global collaboration and greater expansion of our industry within Europe."
SEMICON Europa 2006 programs will be broken into three tracks including Advanced Semiconductor Manufacturing and Packaging, MEMS/Nanotechnology and Photovoltaic. Each topic will be represented throughout the conferences and programs. Companies in these categories will also have the opportunity to showcase their latest technologies in the dedicated Technology Arenas on the show floor.
The Advanced Packaging Conference on April 4 will feature as keynote speaker Kari Kulojarvi, Director of Mechanics and Miniaturization, Nokia. The companies Panasonic, ASM Technology Singapore as well as the Fraunhofer Institute for Reliability and Microintegration (IZM) will debate on "Wafer Level Packaging and Beyond: from Samples to Volumes", the theme of the conference.
In connection with advanced packaging, presentations on lead-free solutions will be held on the show floor at the SEMI technology Arena II, in the perspective of the entry into force of the EU Directive on the Restriction of Use of Hazardous Substances (RoHS) on July 1, 2006.
The MEMS / MST Industry Forum will be held on Monday, April 3, at the Arabella Sheraton Grand Hotel. As keynote speaker, Don Russel, Product Integration Manager, Texas Instruments will present Texas Instruments DLP Technology in MEMS Manufacturing. This one-day conference will focus on MEMS Manufacturing, devices and processes and will end with views from the equipment and services suppliers, which include Alcatel Vacuum Technology, Applied Microengineering, ASML, EVGroup, Frontier Semiconductor, Obducat, Surface Technology Systems, Suss MicroTec.
Also in the MEMS/Nanotechnology track, the Nanoelectronics Forum on Tuesday, April 4 at the ICM examine the issues required to shorten the industrialization cycle form the research lab into the market with a special focus on pure-play nanoelectronics and display companies, established players migrating from micro-scale into nano-scale electronics as well as the essential materials and equipment suppliers supporting this industry. STMicrolectronics, major equipment suppliers, the R&D centres LETI and IMEC and the European Commission will discuss 'Nanoelectornics: Technology to Markets".
The second International Advanced Photovoltaic Manufacturing Technology Conference on Wednesday, April 5 at the ICM will be aimed at exploiting synergies between the photovoltaic industry and semiconductor equipment, materials and technology suppliers and identifying strategies on how to reach photovoltaic mass-production. Also, companies will present their photovoltaic technology in the SEMI Technology Arena II on the show floor. This conference is organized in cooperation with the European Photovoltaic Industry Association (EPIA).
The program for the 10th European Fab Managers Forum was developed in close cooperation with European semiconductor fabs and R&D organizations. Wolfgang Ziebart, CEO, Infineon Technologies will deliver the keynote speech. Taking place on 3 April at the Hotel Arabella Sheraton in Munich, the conference is designed for fab managers, executives and professionals from the semiconductor industry to meet and discuss topical issues that are drivers toward competitive manufacturing. The Forum will offer a series of short presentations, followed by an interactive Fab Managers Executive Panel session.
Also being held in conjunction with SEMICON Europa is the 3d Intellectual Property Seminar, to be held on 4 April at the ICM. This seminar will address specific concerns and concepts around intellectual property worldwide, with presentations from Unaxis, Infineon Technologies, the Centre Suisse d'Electronique et de Microtechnique (CSEM – Switzerland).
Other programs during the week of SEMICON Europa 2006 include the 8th Manufacturing Test Conference on Tuesday, April 4 at the ICM, the Energy Conservation Forum for Semiconductor Manufacturing Equipment on Tuesday, April 4 at the SEMI Technology Arena I (Hall A3) the Semiconductor Equipment and Materials Market Briefing on Wednesday, April 5 at the ICM,
SEMICON Europa will host a comprehensive set of international standards events that includes task force meetings, technical committee meetings and Standards Technical Education Programs (STEP). In addition, there will be a series of SEMI Standards Workshops focusing on e-Manufacturing and Silicon Wafers on Wednesday, April 5 at the ICM.
To commemorate SEMICON Europa's 30th Anniversary, the International Reception, held on Tuesday, April 4 at the ICM will feature Dr. Bertrand Piccard, the first person to circumnavigate the earth non-stop by balloon, who has launched 'Solar Impulse', a project to build and fly with a solar airplane around the world.
