News Article
Henkel innovative lead-free solder paste
Henkel receives industry accolade, bestowed upon the global materials provider at the recent Nepcon China exhibition in Shanghai, China, where the company’s Multicore LF318 lead-free solder paste was awarded the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials.
Developed to appeal particularly to multinational manufacturers who wish to qualify a single solder paste that offers reliable performance regardless of climactic condition, Multicore LF318 is a lead-free, halide-free, pin-testable paste formulation that delivers a broad process window for both printing and reflow.
"This material has broad appeal for many reasons," says Doug Dixon, Global Marketing Manager for the electronics group of Henkel. "In addition to its outstanding reliability and very wide process window, Multicore LF318 is particularly attractive because of its ability to perform well in any climate – from arid to humid. We are pleased that Electronics Manufacturing Asia has recognized these significant advantages and honored Henkel with this prestigious award."
