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TMP and BASF to jointly develop electronic materials

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TMP and BASF announced that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.
The new agreement is a significant expansion of BASF's activities in the electronic materials markets and targets the highly innovative area of copper and barrier CMP-slurries. These are important process chemicals for the planarization of silicon wafers. "TMP and BASF intend to leverage their combined expertise in copper- and barrier CMP-polishing and chemistry aimed at system innovations for the semiconductor industry," said Takehisa Ohkawa, chief executive of TMP. "We look forward to addressing our customers with our strengthened CMP-portfolio and to find the right solution for their polishing needs in order to help them to be more successful," said Dr. Karl-Rudolf Kurtz, Group Vice President of BASF's global business unit Electronic Materials. "TMP has a well-established track record of developing and applying copper and barrier CMP-slurries to customers in the Japanese home market", stated Kurtz.
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