News Article
Opening ceremony held for 12 -inch fabrication plant
Winbond Electronics Corporation has held its grand opening ceremony for the new 12-inch fab at Central Taiwan Science Park.
Guests who attended this historical event included Hung-Duen Yang, Deputy Minister of the National Science Council, Wen-Ke Yang, Deputy General Director of the Central Taiwan Science Park Provisional Office, Chung-Sheng Huang, Magistrate of Taichung County, Jia-Qi Hsiao, Deputy Mayor of Taichung City, customers and suppliers.The 12-inch fabrication plant consists of Fab A and Fab B. The current capacity of Fab A is 8,000 wafers per month and is expected to reach 24,000 wafers per month by the end of 2006. The estimated capacity of Fab B is also 24,000 wafers per month and is expected to start operation after Fab A reaches maximum capacity. After the 12-inch fab begins operation, Winbond will be able to use more advanced process technology to meet the demands of product development. The 0.11- micron process technology has been implemented, followed by the 0.09 - micron to promote a better process ability. The major products to be manufactured in the 12-inch fab are Specialty DRAM, Pseudo SRAM, and part of its capacity will be used for DDR2.
