News Article
Practical Components adds TAPP
Practical Components Inc., announced the availability of Thin Array Plastic Package (TAPP) to its selection of cutting edge technology.
Packaging companies Amkor Technology Inc. and ASAT Holdings Ltd. entered into a multi-year cross-licensing agreement to provide Amkor with a license for its Thin Array Plastic Package (TAPP) semiconductor package technology. "Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fuelled in part by the success of Amkor's proprietary MicroLeadFrame package technology and ASAT's Leadless Plastic Chip Carrier package. We look forward to integrating ASAT's TAPP with our MicroLeadFrame family of packages," said Jim Fusaro, Amkor's corporate vice president for product management, in a statement.
