News Article
New high precision solutions vendor
DynTest Technologies, a new vendor of singulation solutions, enters the market for separation of various substrates used with the production of electronics components.
The high precision Scriber/Breaker is primarily focused to separate III-V wafers i.e. GaAS, GaN and InP. These materials are mainly used to manufacture light emitting diodes (LEDs), Power Laser Diodes, RF Micro Devices and also MEMS. The application of these components is growing fast into various markets like telecom, automotive, illumination, laser and medical instruments. As a next step the company will establish a demo site at Grassau (80 Munich). The purpose of this demo centre will be the demonstration of the enhanced system performance to customers and the expansion of the application to other materials of the electronics component industry.