News Article
TRONIC'S facilitates MEMS demand
TRONIC'S Microsystems, announced that it is extending its capabilities for design, frontend/backend manufacturing and electronic interfacing of MEMS components supported by a 1.7MEUR financial round with its institutional investors.
The French manufacturer, which recently completed the upgrade of its facility from four-inch to six-inch wafer technology, is now installing new dedicated characterisation and test equipment. It also has integrated new competencies in electronic interfacing of MEMS transducers and is broadening its backend offer with high vacuum wafer-level packaging solutions for high performance products like inertial sensors. Those increased capabilities will enable TRONIC'S to serve customer demand in growing global markets with more advanced product solutions and complete development and manufacturing services, including packaging and testing. "TRONIC'S has experienced strong growth and tripled production output since opening the Crolles facility in October 2003," said Peter Pfluger, CEO of TRONIC'S Microsystems.
